据了解，触控芯片商在触控压力传感技术的实作上扮演重要的角色，手机厂若要内置此一功能，多半会先与触控芯片商接洽，而芯片商除提供芯片与Firmware，还会提供建议的触控压力传感电极图案，以使两者达到的匹配效能。接着，触控芯片商会和手机厂、传感电极贴合厂相互协调合作，完成触控压力传感功能。现阶段，包括意法半导体（ST）、敦泰（FocalTech）、新思（Synaptics）、Hydis皆已具备触控压力传感方案，而思立微和汇顶科技（Goodix）等其他触控芯片业者今年也预计会加入此一市场战局。

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